3D integration photonic interposer is becoming popular in the field of co-packaging optics (CPO). In this paper, we integrate the edge coupler and through silicon via (TSV) into the silicon interpo…
A popular robust alternative of the classic principal component analysis (PCA) is the -norm PCA (L1-PCA), which aims to find a subspace that captures the most variation in a dataset as measured by…
This article reviews the potential channel decoding techniques for ultra-reliable low-latency communications (URLLC). URLLC is renowned for its stringent requirements including ultra-reliability, l…
Monolithic integration of infrared photodetectors on a silicon platform is a promising solution for the development of scalable and affordable photodetectors and infrared focal plane arrays. We rep…
We present a mixed-integer linear program (MILP) for line planning with mode and route choice. In contrast to existing approaches, the mode and route decisions of passengers are modeled depending o…
With the unprecedented developments in deep learning, automatic segmentation of main abdominal organs seems to be a solved problem as state-of-the-art (SOTA) methods have achieved comparable result…
Fine-grained image analysis (FGIA) is a longstanding and fundamental problem in computer vision and pattern recognition, and underpins a diverse set of real-world applications. The task of FGIA tar…
We study the notion of consistency between a 3D shape and a 2D observation and propose a differentiable formulation which allows computing gradients of the 3D shape given an observation from an arb…
By employing the mode decomposition method to study the relative mode evolution characteristics during the stimulated Raman scattering (SRS) process, a numerical model of the core-pumped Raman effe…
The purpose of this note is to point out the mistake in the above article. The affiliation of the author was modified. This correction was consistent with the original version of the article, and h…