Gaya APA
Elmogi, Ahmed, Bauwelinck, Johan, Campenhout, Joris Van, Heyn, Peter De, Srinivasan, Ashwyn, Amann, Markus-Christian, Spiga, Silvia, Missine, Jeroen, Xin Yin, Ramon, Hannes, Soenen, Wouter, Steenberge, Geert Van. ().
Aerosol-Jet Printed Interconnects for 2.5 D Electronic and Photonic Integration .
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Gaya Chicago
Elmogi, Ahmed, Bauwelinck, Johan, Campenhout, Joris Van, Heyn, Peter De, Srinivasan, Ashwyn, Amann, Markus-Christian, Spiga, Silvia, Missine, Jeroen, Xin Yin, Ramon, Hannes, Soenen, Wouter, Steenberge, Geert Van.
Aerosol-Jet Printed Interconnects for 2.5 D Electronic and Photonic Integration.
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Text.
Gaya MLA
Elmogi, Ahmed, Bauwelinck, Johan, Campenhout, Joris Van, Heyn, Peter De, Srinivasan, Ashwyn, Amann, Markus-Christian, Spiga, Silvia, Missine, Jeroen, Xin Yin, Ramon, Hannes, Soenen, Wouter, Steenberge, Geert Van.
Aerosol-Jet Printed Interconnects for 2.5 D Electronic and Photonic Integration.
:
,
.
Text.
Gaya Turabian
Elmogi, Ahmed, Bauwelinck, Johan, Campenhout, Joris Van, Heyn, Peter De, Srinivasan, Ashwyn, Amann, Markus-Christian, Spiga, Silvia, Missine, Jeroen, Xin Yin, Ramon, Hannes, Soenen, Wouter, Steenberge, Geert Van.
Aerosol-Jet Printed Interconnects for 2.5 D Electronic and Photonic Integration.
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Print.