Gaya APA
Matsumoto, Takeshi, Akiyama, Suguru, Kawashima, Hitoshi, Ikeda, Kazuhiro, Takabayashi, Kuzumasa, Uetake, Ayahito, Tanizawa, Ken, Suzuki, Keijiro, Konoike, Ryotaro, Kurahashi, Teruo, Sekiguchi, Shigeaki. ().
Hybrid-Integration of SOA on Silicon Photonics Platform Based on Flip-Chip Bonding .
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Gaya Chicago
Matsumoto, Takeshi, Akiyama, Suguru, Kawashima, Hitoshi, Ikeda, Kazuhiro, Takabayashi, Kuzumasa, Uetake, Ayahito, Tanizawa, Ken, Suzuki, Keijiro, Konoike, Ryotaro, Kurahashi, Teruo, Sekiguchi, Shigeaki.
Hybrid-Integration of SOA on Silicon Photonics Platform Based on Flip-Chip Bonding.
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Gaya MLA
Matsumoto, Takeshi, Akiyama, Suguru, Kawashima, Hitoshi, Ikeda, Kazuhiro, Takabayashi, Kuzumasa, Uetake, Ayahito, Tanizawa, Ken, Suzuki, Keijiro, Konoike, Ryotaro, Kurahashi, Teruo, Sekiguchi, Shigeaki.
Hybrid-Integration of SOA on Silicon Photonics Platform Based on Flip-Chip Bonding.
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,
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Text.
Gaya Turabian
Matsumoto, Takeshi, Akiyama, Suguru, Kawashima, Hitoshi, Ikeda, Kazuhiro, Takabayashi, Kuzumasa, Uetake, Ayahito, Tanizawa, Ken, Suzuki, Keijiro, Konoike, Ryotaro, Kurahashi, Teruo, Sekiguchi, Shigeaki.
Hybrid-Integration of SOA on Silicon Photonics Platform Based on Flip-Chip Bonding.
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