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Jiang, Bocheng, Chen, Yan, Liang, Hong, Lu, Xinchun, Fang, Alex, Liu, Bingtong, Liu, Yuhong. ().
Surface Stress Evolution in Through Silicon Via Wafer During a Backside Thinning Process .
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Jiang, Bocheng, Chen, Yan, Liang, Hong, Lu, Xinchun, Fang, Alex, Liu, Bingtong, Liu, Yuhong.
Surface Stress Evolution in Through Silicon Via Wafer During a Backside Thinning Process.
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Text.
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Jiang, Bocheng, Chen, Yan, Liang, Hong, Lu, Xinchun, Fang, Alex, Liu, Bingtong, Liu, Yuhong.
Surface Stress Evolution in Through Silicon Via Wafer During a Backside Thinning Process.
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,
.
Text.
Gaya Turabian
Jiang, Bocheng, Chen, Yan, Liang, Hong, Lu, Xinchun, Fang, Alex, Liu, Bingtong, Liu, Yuhong.
Surface Stress Evolution in Through Silicon Via Wafer During a Backside Thinning Process.
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