Text

Ball Lens Embedded Through-Package Via To Enable Backside Coupling Between Silicon Photonics Interposer and Board-Level Interconnects

Development of an efficient and densely integrated optical coupling interface for silicon photonics based board-level optical interconnects is one of the key challenges in the domain of 2.5D/3D electro-optic integration. Enabling high-speed on-chip electro-optic conversion and efficient optical transmission across package/board-level short-reach interconnections can help overcome the limitations of a conventional electrical I/O in terms of bandwidth density and power consumption in a high-performance computing environment. In this context, we have demonstrated a novel optical coupling interface to integrate silicon photonics with board-level optical interconnects. We show that by integrating a ball lens in a via drilled in an organic package substrate, the optical beam diffracted from a downward directionality grating on a photonics chip can be coupled to a board-level polymer multimode waveguide with a good alignment tolerance. A key result from the experiment was a 14 μ m chip-to-package 1-dB lateral alignment tolerance for coupling into a polymer waveguide with a cross-section of 20 × 25 μ m 2 . An in-depth analysis of loss distribution across several interfaces was done and a −3.4 dB coupling efficiency was measured between the optical interface comprising of output grating, ball lens and polymer waveguide. Furthermore, it is shown that an efficiency better than −2 dB can be achieved by tweaking few parameters in the coupling interface. The fabrication of the optical interfaces and related measurements are reported and verified with simulation results.

Ketersediaan

Informasi Detail

Judul Seri

JOURNAL OF LIGHTWAVE TECHNOLOGY; Vol.38 No.8 April 15 2020

No. Panggil

-

Penerbit

: .,

Deskripsi Fisik

p. 2360 - 2369

Bahasa

English

ISBN/ISSN

-

Klasifikasi

-

Tipe Isi

-

Tipe Media

-

Tipe Pembawa

-

Edisi

-

Subjek

SILICON PHOTONICS
POLYMER WAVEGUIDES
DATACENTERS
BALL LENS
CHIP-TO-BOARD COUPLING
OPTICAL INTERPOSER

Info Detail Spesifik

-

Pernyataan Tanggungjawab

Nivesh Mangal, Jeroen Missinne, Joris Van Campenhout, Bradley Snyder, Geert Van Steenberge

Versi lain/terkait

Lampiran Berkas

Komentar