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Co-Packaged Photonics For High Performance Computing : Status, Challenges And Opportunities

Photonics die or integrated photonics modules co-packaged with compute engines have the potential to deliver significant improvements in power, bandwidth and reach needed to meet the computing and communication demands of data centers and other high-performance computing (HPC) systems. The challenges and solutions in co-packaging photonics modules are described through two case studies; one of a network-switch die co-packaged with socketable photonics modules and another of a Field Programmable Gate Array (FPGA) co-packaged with optical dies (tiles). The technical requirements to deliver the promise of co-packaged photonics in high volume are outlined.

Ketersediaan

Informasi Detail

Judul Seri

JOURNAL OF LIGHTWAVE TECHNOLOGY; Vol.40 No.2 January 15 2022

No. Panggil

-

Penerbit

: .,

Deskripsi Fisik

p. 379-392

Bahasa

English

ISBN/ISSN

-

Klasifikasi

NONE

Tipe Isi

-

Tipe Media

-

Tipe Pembawa

-

Edisi

-

Subjek

FPGA
SWITCH
CO-PACKAGED PHOTONICS
O-TILE
PHOTONIC ENGINES

Info Detail Spesifik

10.1109/JLT.2021.3104725

Pernyataan Tanggungjawab

Ravi Mahajan, Xiaoqian Li, Joshua Fryman, Zhichao Zhang, Srikant Nekkanty, et al.

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