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A Compact Fluorescent Probe for Real-Time Thermal Monitoring of Chips
In this paper, a compact fluorescent probe based on fluorescence intensity ratio (FIR) technique is proposed for real-time thermal monitoring of chips, the sensing unit of which is based on a self-made tellurite optical fiber (TOF) co-doped with Er 3+ /Yb 3+ ions. Temperature information was demodulated by analyzing the up-conversion fluorescence emission spectra generated using a 980 nm laser pump. Experimentally characterized the relationship between the FIR related to two thermally coupled energy levels and the ambient temperature, and on-line investigated the temperature change of Central Processing Unit (CPU) and North Bridge Chip for about 80 min during the cycle startup/shutdown process. The proposed probe exhibits a fast time response of about 1.1 s in a step temperature-varying environment and a small absolute error of
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