Wafer map defect patterns provide valuable information for root cause analysis and yield learning. Previous studies show that supervised machine learning (ML) methods can achieve good defect patter…
Spatial failure patterns in wafer defect maps are very useful for root cause analysis, which is essential for yield optimization in the manufacturing process. Especially, the scratch defect type is…
Wafer test is carried out after integrated circuits (IC) fabrication to screen out bad dies. In addition, the results can be used to identify problems in the fabrication process and improve manufac…
Wafer map defect pattern recognition provides useful clues to yield learning. However, most wafer maps have no special spatial patterns and are full of noises, which make pattern recognition diffic…