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Critical Dimension Bimodality Both Within Wafer and Within Die

With reduction in the die sizes it is very critical to control the Critical Dimension (CD) within a very precise window. In this work we present a root cause analysis and solution to a bimodal CD distribution seen from the center of the wafer. The CD bimodality displays a sharp cliff at the center of the wafer, wherein one side of the wafer has the higher CD and the other side has lower CD with respect to the target value. The bimodality was also seen in the center column of the wafer.

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Informasi Detail

Judul Seri

IEEE TRANSACTIONS ON SEMICONDUCTOR MANUFACTURING; Vol.33 No.3 August 2020

No. Panggil

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Penerbit

: .,

Deskripsi Fisik

p. 487 - 489

Bahasa

English

ISBN/ISSN

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Klasifikasi

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Tipe Isi

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Tipe Media

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Tipe Pembawa

-

Edisi

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Subjek

DEVELOPER
PHOTOLITHOGRAPHY
CRITICAL DIMENSION
BIMODAL
SPIN SPEED
PATTERN DENSITY

Info Detail Spesifik

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Pernyataan Tanggungjawab

Talapady Srivatsa Bhat, Gagan Aggarwal, Ganesh Yerubandi, David Bolton

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